2022 Volume 58 Issue 2 Pages 66-72
Temporary bonding tapes for Fan-Out Panel Level Packaging are required to possess high heat resistance. Hence, silicone adhesive tapes are coonly used in the industry. However, silicone adhesives transfer low-molecular siloxane to the adherend, which causes connection failures of the circuit joints. This paper reports that a newly designed pressure-sensitive adhesive（ P.S.A.） performed high heat resistance and low adhesive transfer to an adherend surface. The P.S.A. consists of 2-ethylhexyl acrylate as the main monomer, polyisocyanate including an isocyanurate ring as the crosslinker, and a reactive elastomer （RE） with polybutadiene as the additive agent. Furthermore, the P.S.A exhibited excellent peeling performance with extremely low adhesive transfer to silicon wafers with patterned steps. We found that RE effectively enhanced the performance of the P.S.A. by increasing the true breaking strain and breaking stress.
