Basics and Applications of Thermomechanical Analysis（TMA）and Dynamic Mechanical Analysis（DMA） for Adhesives

Abstract

TMA（Thermomechanical Analysis）is a method for measuring deformation（change in length）depending on temperature changes, can determine the coefficient of thermal expansion. Furthermore, if deformation occurs due to phase transition, the transition temperature can be examined. DMA（Dynamic Mechanical Analysis）is a method to measure changes in viscoelastic properties depending on temperature changes. As with TMA, if a change in elastic modulus occurs due to a phase transition or the like, the transition temperature can be examined. The dimensions of adhesives change depending on the curing reaction. And the softening behavior is different due to control the degree of curing according to the purpose of use. The adhesive strength after curing may also vary depending on the environmental temperature used. Therefore, the evaluation by TMA and DMA is necessary for adhesives.