Adhesion Properties and Raman Spectroscopy Around Adhesion Interphase

Abstract

Adhesion without any mechanical damages by punching or drilling process is a key technology in industrial manufacturing fields. For the construction of reliable and robust adhesion system, the evaluation and control of the structure and physical properties of the adhesion interphase are significant. Recently, various analyses methods of the adhesion interphase have been developed and the adhesion interphase and the interphase possesses three dimensional structure, not two dimensional. In this review, the adhesion interphase through analyses using confocal Raman microspectroscopy. The interphase thickness is controlled by the morphology of adhered substrates. In the case of crystalline polymer-based substrates, crystallinity of the substrates decides the interphase thickness. The interphase thickness has large correlation with the adhesion strength. This trend is observed in the specimens with isotactic polypropylene or polyamide 66 substrates. In the adhesion system using thermal melting as well as that using reactive curing adhesives, the interphase thickness is controlled. The adhesion specimen of amorphous epoxy substrates and adhesives also possesses interphase structure, which is formed by two different mechanism and is largely received by thermal effect. These results mean that the fine control of the structure of adherents and adhesives develop adhesion manufacturing.