Abstract
A method of spectrophotometric determination of bismuth as its iodide complex (460 mμ) after anion exchange separation has been presented, by which trace amounts of Bi in solder alloys have been determined with satisfactory results.
An anion exchange resin, Diaion SA # 100(100200 mesh, Cl-form), was used for separating Bi in solder alloys.
Pb was eluted with 8M HCl, then Sn (IV) with 2M HNO3 and finally Bi with 0.5M HNO3. Other impurities, such as Cu, Fe, Al, As, and Zn did not interfere the photometric measurements.
