Copper ion-responsive chemical bimetal using 7-(dodecenyl)-8-quinolinol

Abstract

A chemical bimetal comprises a combination of two kinds of polymer plates having different characteristics regarding certain physical quantities of a dipping solution. One plate does not shrink or expand in the solution. The other plate contains a substance that is sensitive to the dipping solution, and either shrinks or expands. The chemical bimetal thus curves according to the reactive substance concentration in the solution. A copper ion-responsive chemical bimetal comprised a reaction film, which was made from 25% 7-(dodecenyl)-8-quinolinol (LIX26), 25% dioctyl phthalate (DOP) and 50% polyvinyl chloride (PVC), and polyester film. The thickness of the reaction layer was 0.6 mm and that of the polyester film was 0.1 mm. This chemical bimetal responded to the copper ion and showed an almost linear response from 0.01 to 0.15 mM. The amount of change in the position (ACP) of the chemical bimetal was 7.9 mm in a 0.1 M acetate buffer solution containing 0.15 mM copper ion (pH 4.5). The interferences of Fe³⁺, Ni²⁺, Zn²⁺, Al³⁺, and Cd²⁺ on the response of copper ion by the chemical bimetal were investigated at various reaction times and pH.