Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Design approach to build up hight density PCB test system
Hayashi Kajitani, Yoshitomi Munakata, Hisashi Noji, Tomonori Ariga
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Keywords: PCB Testing, In Circuit Test, CAD, Boundary Scan, Flying Probe Tester, Design For Test
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 127

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Abstract
[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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