Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
Conference information

Host: Japan Institute of Electronics Packaging

Influence of various additives on the microstructure and internal stress in copper electroformed from acid copper sulfate bath
Junichi TOKUNAGA, Yutaka TSURU
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 2

Details
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2002 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top