Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 19B-08
Conference information

Host: Japan

Aligned bonding of 4-inch wafers by the surface activated bonding
*Hideki Takagi†, Keisuke Nishida†, Yasushiro Nishioka†, Ryutaro Maeda†
Author information
Keywords: Wafer Bonding, Aligned Bonding, Surface Activated Bonding, Room-temperature Bonding, MEMS
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (153K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2004 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top