Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 19B-10
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Host: Japan

Room Temperature Vacuum Sealing Using Surface Activated Bonding Method
*Toshihiro Itoh†, Hironao Okada†, Hideki Takagi†, Ryutaro Maeda†, Tadatomo Suga†
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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