Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 19C-18
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Host: Japan

Study on Reduction in Radiated Emission Using Package with Built-in Decoupling Components
*Ken Nakano†, Toshio Sudo†, Satoru Haga†
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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