Proceedings of JIEP Annual Meeting
The 18th JIEP Annual Meeting
Session ID : 17B-04
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Host: Japan

The analysis of Influence in the reliability of BGA solder joints
*Hirokazu Abe†, Qiang Yu†, Jae-Chul Jin†, Masaki Shiratori†
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[in Japanese]
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© 2004 by The Japan Institute of Electronics Packaging
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