Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-17
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Host: Japan Institute of Electronics Packaging

Evaluation of Electric and Mechanical Characteristics of Micro Bonded Part using Conductive Adhesives
*Yukimasa Yoshizawa, Kozo Ikegami
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Keywords: Creep property of conductive adhesives
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[in Japanese]
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© 2006 by The Japan Institute of Electronics Packaging
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