Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 24A-06
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Host: Japan Institute of Electronics Packaging

The Effect of Heat Spreader on Package Warpage
*Tomohiro Noguchi, Masazumi Amagai
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Keywords: Inverse Analysis, FEM, Warpage, Heat Spreader
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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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