Host: Japan Institute of Electronics Packaging
The Jisso Technology has been reviewed from microwave engineering view points. For avoideing multi-mode signal propagation, controlling the thickness of substrates is important. Nonlinearity of active devices and thermal memory effects cause the signal distortion such as 3rd order intermodulation distortion. To suppress the distortion, controlling impedance not only at signal frequencies but also harmonic and subharmonic frequencies are necessary. For evaluation of high frequency components, the concept of mathematical impedance matching as well as the concept of mathematical unilateralization for measured data is effective.