Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 22C-02
Conference information

Host: Japan Institute of Electronics Packaging

Roadmap of Optoelectronics Packaging Technology - Progress and Possibility of Optical Interconnection -
*Masato Shishikura
Author information
Keywords: Optical Interconnection, Optoelectronics Packaging Technology, Roadmap
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (31K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract

[in Japanese]

Content from these authors
© 2006 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top