Abstract
Printed wiring boards (PWBs) have evolved in the direction of higher densities as electronic equipment has become smaller and lighter. These higher densities have been achieved with finer lines and spaces, an increase in the number of layers, and smaller diameters and larger aspect ratios of through holes and blind holes. Electroless copper deposition provides good uniformity of thickness in the plated foil, and high throwing power. For these reasons, electroless copper deposition has become a key technology in manufacturing high-density PWBs.
The characteristics of the electroless copper deposits for foundation are not considered significance, therefore the relationship between the characteristic of the electroless copper deposits for foundation and the reliability to the through hole interconnection is still far from being fully understood. In this study, the relationship between the characteristics of the deposits(the voids existed at deposits, grain size, internal stress and impurity(Cu2O)) and the reliability to the through hole interconnection were investigated.
