Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 14A-03
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Host: japan institute of electronics packaging

Effect of a Catalyzing Process for the Improvement of Solderability
*Tomoyuki Yamamoto, Hideto Watanabe, Hideo Honma
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Keywords: Strength of Solder Joint, P-rich Layer, Elecrtoless Nickel Plating, Morphology, Non-catalyzing Process
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[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging
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