The 17th JIEP Annual Meeting
Session ID : 14A-08
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Host: japan institute of electronics packaging
Vacuum bonding properties of Si/Glass and Si/Si for three dimensional stacking LSI processes
*Mitsuo Ueno, Kouji Marusaki, Yuichi Taguchi, Yoshihiko Nemoto, Masataka Hoshino, Kenji Takahashi
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