DEVELOPMENT OF 3-DIMENSIONAL TYPE MULTI CHIP PACKAGE

Abstract

Now Stacked-MCP which carries a fewchips are mass produced. However, in this former tipe package, it is clear that there is a limit to a number of chips,line/space on board for further performance and capacity. For this problem, Fujistu proposes PS-MCP. This is three dimensional package which carries some Stacked-MCP packages.This paper introduces the structure, measures for some ploblems through development and our plan of PS-MCP.