Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 14B-09
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Development of Optoelectronic Hybrid Boards using Optical Fibers
*Ken-ichi HigashiuraMakoto Kato
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

In recent years, as the transmission speed increases, optical interconnections is desired not only in the device but also in the board-level. Therefore, an optical wiring layers are accumulated to the electric wiring board, and the optoelectronic hybrid boards which replaces a part of the electric wiring with optical wiring is paid to attention. For the achievement example, we have previously proposed a new structure and a method of the optoelectronic hybrid boards that endures the solder reflow process by optical components is embedded in a glass-epoxy circuit board.

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© 2003 by The Japan Institute of Electronics Packaging
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