Host: japan institute of electronics packaging
In recent years, as the transmission speed increases, optical interconnections is desired not only in the device but also in the board-level. Therefore, an optical wiring layers are accumulated to the electric wiring board, and the optoelectronic hybrid boards which replaces a part of the electric wiring with optical wiring is paid to attention. For the achievement example, we have previously proposed a new structure and a method of the optoelectronic hybrid boards that endures the solder reflow process by optical components is embedded in a glass-epoxy circuit board.