Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 14C-05
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Host: japan institute of electronics packaging

Visualization of Solder Joint Shape in a Wafer Level CSP Using Dry-Contact Ultrasound
*Hironori Tohmyoh, Masumi Saka
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Keywords: Ultrasonic Inspection, Dry-Contact, Wafer Level CSP, Solder Joint
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[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging
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