Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 14C-16
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Host: japan institute of electronics packaging

Surface Activated Bonding of Sputter Deposited Platinum Films on Wafers
*Hideki Takagi, Ryutaro Maeda
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Keywords: Surface Activated Bonding, Wafer Bonding, Platinum Film, Sputter Deposition, Argon Beam
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Abstract

[in Japanese]

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© 2003 by The Japan Institute of Electronics Packaging
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