The 17th JIEP Annual Meeting
Session ID : 12B-05
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Host: japan institute of electronics packaging
Method for the integrated reliability analysis in electronics packaging
*Kenji Hirohata, Katsumi Hisano, Minoru Mukai, Noriyasu Kawamura, Hideo Iwasaki, Takashi Kawakami, Masayuki Miura, Yoshiaki Sugizaki, Toshio Sudo
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