Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 12B-09
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Host: japan institute of electronics packaging

Study of voids in solder ball for BGA
*Tomonori Fujimaru, Yasuhide Ohno, Tsumosu Takako, Takashi Nakamori
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Keywords: Ball Grid Array, Joint of solder Ball for Ball Grid Array, void
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[in Japanese]
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© 2003 by The Japan Institute of Electronics Packaging
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