Cu Electroless Plating on Liquid Crystal Polymer Films

The Effect of Surfactant on Adhesion Strength

Abstract

It is known that liquid crystal polymer film exhibits excellent mechanical and physial characteristics compared with those of other polymers. In order to apply LCP film to the printed circuit board, the eching condition on LCP film to obtain good anchor effect for electroless copper plating was studied. After etching LCP film in the 10 M KOH solution at 70 for 60~120 min, the film was catalyzed in the solution containing SnCl2 and PdCl2, where some sorts of surfactant was added. In this study, the effect of surfactant on the adhesion strength was studied, and an excellent adhesion strength using an anionic surfactant could be obtained.