The 17th JIEP Annual Meeting
Session ID : 12B-15
Conference information
Host: japan institute of electronics packaging
Examination of the impact test equipment used for the assessment of drop impact reliability for the solder joints
Yu Qiang, Kikuchi Hironobu, *Watanabe Keiji, Shiratori Masaki, Kakino Manabu, Fujiwara Noriyuki
Author information
Keywords:
drop impact analysys,
Transient Response Analysis,
repetitive drop test,
drop impact reliability
Details
