Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 12C-03
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Host: japan institute of electronics packaging

Simulation of power bus resonance in multilayer pcbs with slits
*Teppei Akazawa, Tomohiro Toyota, Zhi Liang Wang, Yoshitaka Toyota, Osami Wada, Ryuuji Koga
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Keywords: slit, segmentation method, power bus resonance, EMI simulation, PCB
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[in Japanese]
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© 2003 by The Japan Institute of Electronics Packaging
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