Influence of GND-pin Arrangement on Transmission Property of Flip Chip BGA.

Abstract

On the high frequency semiconductor package, it is thought that arrangement of FC vamp, BGA solder ball, affects an electrical property. Then, in this paper, in order to grasp the influence quantitatively, (1)when flip chip mounting was performed to a build up board and (2) Build-up BGA was mounted in PCB, (3)when flip chip mounting was performed to Build-up BGA, and it is mounted in PCB, where the number of GND pins to a signal pin or GND pin arrangement is changed in (1) - (3), measurement and the simulation were performed about change of a transmission property.