The 17th JIEP Annual Meeting
Session ID : 13A-16
Conference information
Host: japan institute of electronics packaging
Development of High Modulus Insulation Resin for Build-up Type P.C.B.
*Seiichi Saito, Yoshinori Takahata, Yoshihiro Fukuda, Takahiro Mori, Setsuko Hirakawa, Shingo Nakao
Author information
Details
