Abstract
The inkjet technology is an environment-friendly technology in terms of resources and energy savings. Applied studies of inkjet technology for the industrial fabrication of electric devices have been advanced. In those studies, fabrications of electric circuits using inkjet ink contained nano-sized metal have been mainly reported. In this study, preparation of copper circuits by using ink contained activator for electroless copper plating on polyimide films was investigated, and electric properties of plated copper patterns were examined.
