Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15C-11
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Development of new Pb-free high melting point solder by vacuum evaporation.
*Toshihide Takahashi, Tatsuoki Kohno
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Keywords: vacuum evaporation, intermetallic compound, high melting point solder
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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