Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15C-13
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Effect of Phosphorus Addition to Sn-Ag-Cu Solder on Erosion of Stainless Steels
*Tatsuhiko Kobayashi, Tadashi Takemoto, hiroshi Nishikawa, Feng Gao
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Keywords: lead-free solder, erosion, phosphorus addition, stainless steel, reaction product
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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