Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14B-06
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Measurement of the Back-side Conductivity of Copper-clad Dielectric Substrate
*Suguru AibaYoshio KobayashiZhewang Ma
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Abstract
Back-side conductivity of copper-clad dielectric substrate fall down at microwave renge. Because current concentrate near the surface of conductor at microwave renge and copper was defeated when it is stretched on substrate. In this paper we show measured results of frequency dependency of back-side conductivity of copper-clad dielectric substrate using MIC resonator method.
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© 2007 by The Japan Institute of Electronics Packaging
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