Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14C-01
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Recent Advances in 0ptoelectronic Packaging Technology inside Box
*Takashi Mikawa
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Keywords: 0ptoelectronic packaging technology, Optical interconnection
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Abstract
We describe R & D status and future challenges of the optoelectronic packaging technology including high-speed optical backplane and OE-conversion module for application to the optical interconnects inside box.
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© 2007 by The Japan Institute of Electronics Packaging
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