Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14C-06
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Development of Au bump for by electroless deposition and its application to flip chip bonding
*Tokihiko Yokoshima, Yasuhiro Yamaji, Hirotaka Oosato, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi
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Keywords: Au bump, electroless deposition, flip chip bonding
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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