Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14C-13
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Image sensor packaging technology to reduce curvature of field.
*Chihiro Mochizuki, Fujiaki Nose, Hiroshi Kikuchi
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Keywords: sensor chip, curvature of field, warp of chip, control
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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