Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15A-03
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Underfill analysis of mounted flip chip
*Akira Tanaka, Akihiko Hatsupouya
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Keywords: Underfill, flip chip, analysis
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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