Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 15A-05
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Development of dryfilm soldermask having improved durability for gold plating
*Shigeru Murakami, Eiji Kosaka, Yumiko Tajima, Terumi Suzuki
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Keywords: Soldermask, Photoresist, Dryfilm, GoldPlating, Solder
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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