Proceedings of JIEP Annual Meeting
The 27th JIEP Annual Meeting
Session ID : 13F-03
Conference information

Host: Japan Institute of Electronics Packaging

The 27th JIEP Annual Meeting
Toughening of heat cationic cured cycloaliphatic epoxy resin
*Hitomi Togawa, Toshiyuki Oyama, Akio Takahashi
Author information
Keywords: epoxy resin, heat cationic cure, in situ polymerization of modifiers, Thermosetting resin, Toughening
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (644K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2013 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top