The 30th JIEP Annual Meeting
Session ID : 24B2-5
Conference information
Host: Japan Institute of Electronics Packaging
The 30th JIEP Annual Meeting
Stopband Expansion of Vialess Open-stub EBG structure for Power-bus Noise Reduction
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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