Proceedings of JIEP Annual Meeting
The 32nd JIEP Annual Meeting
Session ID : 7P1-5
Conference information

Host: Japan Institute of Electronics Packaging

The 32nd JIEP Annual Meeting
Development of Wafer Bonding Technology in Air Using Smooth Titanium Thin Films with a Thickness of Several Tens of Nanometers
*[in Japanese], [in Japanese], [in Japanese]
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (978K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2018 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top