The 32nd JIEP Annual Meeting
Session ID : 6C1-2
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Host: Japan Institute of Electronics Packaging
The 32nd JIEP Annual Meeting
Thermal Characterization of Metal Bonded Ceramic Substrate by Using SiC Heater Chip Simulating Power Device Packaging
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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