The 35th JIEP Annual Meeting
Session ID : 17A1-01
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Host: Japan Institute of Electronics Packaging
The 35th JIEP Annual Meeting
Proposal of thermal resistance calculation method for printed circuit boards with surface-mount components
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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