福岡大学半導体実装研究所と三次元半導体研究センターでの三次元実装の取組み

加藤 義尚; 韓 榮建; 林 繁宏; 末吉 晴樹; 野北 寛太

doi:10.11486/ejisso.35.0_19B1-01

The 35th JIEP Annual Meeting

Session ID : 19B1-01

DOI https://doi.org/10.11486/ejisso.35.0_19B1-01

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Host: Japan Institute of Electronics Packaging

The 35th JIEP Annual Meeting

Activities for 3D mounting at The Microelectronics Assembly and Packaging Laboratory (IMAP) of Fukuoka University and 3D Semiconductor Research Center

*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]

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