The 36th JIEP Annual Meeting
Session ID : 23A2-4
Conference information
Host: Japan Institute of Electronics Packaging
Name : The 36th JIEP Annual Meeting
Date : March 23, 2022 -
The 36th JIEP Annual Meeting
Reliability Evaluation of Power Modules Using Cu-Sn-Based IMC Joint Materials
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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