Proceedings of JIEP Annual Meeting
The 39th JIEP Annual Meeting
Session ID : 11A4-3
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Host: Japan Institute of Electronics Packaging

The 39th JIEP Annual Meeting
Effect of Adding Submicrometer-sized Fillers on Electrical Conductivity and Reliability of Copper-filled Conductive Paste Composed of a Resole-type Phenolic Binder
*[in Japanese], [in Japanese]
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