The 39th JIEP Annual Meeting
Session ID : 13B5-1
Conference information
Host: Japan Institute of Electronics Packaging
The 39th JIEP Annual Meeting
Fundamental Investigations of Bond Strength and Thermal Resistance for Novel Bi-based High-Temperature Lead-Free Plate Solder
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Details
Article 1st page
