The 39th JIEP Annual Meeting
Session ID : 13B5-3
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Host: Japan Institute of Electronics Packaging
The 39th JIEP Annual Meeting
Copper-Clad Boards that Have Both High Thermal Conductivity and Thermal Cycle Reliability using a High Fracture Toughness AlN Substrate substrate
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
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