Stabilization of bend orientation using micro-patterned alignment structures formed by microcontact printing

Abstract

We propose novel pi-cells with micro-alignment structures fabricated by microcontact printing (uCP) method. A patterned vertical-alignment-layer was formed on a uniform horizontal-alignment-layer on a substrate by uCP method. The devices with the hybrid or vertical micro-patterning can stabilize bend-state, such as no need of the initialized voltage to transit from splay-state to bend-state, and no operating bias voltage above the critical voltage to keep the bend-state. In this paper, we discuss the fabrication process and features of the stabilized bend-mode cells.