Improving Adhesion between Fiber and Coating Material

Abstract

The supercritical fluid method was used to copper-plate poly(ethylene terephthalate) fibers. First, selected Pd-complexes were impregnated into the fibers and free Pd metal was decomposed in the fibers by heat reduction. Using precipitated Pd, electroless copper plating was successfully performed. Poly(ethylene terephthalate) fibers having different shapes of cross section were investigated to improve the adhesion property of the copper plated on the fibers. The fibers having peanut shape of cross section had higher conductive properties than the other fibers having triangle or circular cross section, even after abrasion and washing tests. To improve adhesion between fiber and plated metal much more, an attempt has been done to change surface modification of fiber by UV or plasma. The copper plated fibers after treating surface modifications had higher conductivity than the non-treated fiber. Better adhesion property was obtained by these pretreatments.